microDAC® measuring systems are modular high-performance systems for non-destructive material testing using 2D analysis of movements, deformations and strains based on digital image correlation (DIC).
The measuring systems work on the basis of a highly accurate digital image correlation method (DIC) and use the natural structure of the measured object surface to determine the smallest local displacements and strains. Sample preparation is only required for transparent and shiny materials.
The microDAC® measuring systems have a wide range of applications in science and technology and are used by numerous companies, research institutes and universities for materials testing, product development and reliability analysis.
The universally applicable microDAC® measuring system is a modular high-performance system for non-destructive material testing using 2D analysis of movements, deformations and strains based on digital image correlation (DIC). on the basis of digital image correlation (DIC). The systems are characterized by a high flexibility of the optical setup and allow you a comfortable and time-effective evaluation.
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The Video Extensometer - microDAC® strain is a DIN EN ISO 9513-certified video extensometer for tensile/compression tests, with which the longitudinal and transverse strains are simultaneously measured directly on the specimen surface (without additional markings). transverse strains are measured simultaneously without contact and with high precision directly on the specimen surface (without additional markings).
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Our microDAC® CTE measuring device offers a fast and fully automatic measurement that is ideal for efficient use in material analysis. Fully automatic! A highly accurate, non-contact measurement is carried out in two spatial directions (x, y) and up to 6 material samples can be tested in parallel! -> 12 CTE values simultaneously! -> Temperature range -40°C to 300°C!
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The microDAC® TL is a camera-based measurement system with an integrated thermal chamber, specifically designed for high-precision in-plane thermal strain measurements. It combines advanced image capture technology with innovative software support to enable material and system analysis of the highest standard.
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