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R. Dudek, P. Fruehauf, L. Kreher, S. Richter-Trummer, J. Albrecht, S. Rzepka, L. Scheiter, and A. Weigert, "Secondary Effects Causing Early Solder Fatigue Failure of QFN Components Subjected to Test- and Field Cycling", in 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026, pp. 1–9, doi: 10.1109/EuroSimE69483.2026.11511909. https://doi.org/10.1109/EuroSimE69483.2026.11511909
I. Maus, P. Altieri–Weimar, W. Hartner, M. Niessner and B. Bäumer, "Deformation measurement on cross sections of Fan-Out Wafer Level Package by Digital Image Correlation (DIC)", 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania, 2022, pp. 473-479, doi: 10.1109/ESTC55720.2022.9939400. https://doi.org/10.1109/ESTC55720.2022.9939400
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B. Vandevelde, R. Labie, R. Lauwaert, R. Dudek, P. Gromala and M. Eichorst, "Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints", 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz, Austria, 2023, pp. 1-8, doi: 10.1109/EuroSimE56861.2023.10100841. https://doi.org/10.1109/EuroSimE56861.2023.10100841
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