Products
microDAC® TL - Thermal In-Plane Deformation System
Thermal In-Plane Deformation System microDAC® TL

Understanding Thermomechanical Processes: Precise In-Plane analysis for maximum reliability in electronics and material research.

The microDAC® TL combines state-of-the-art image acquisition with an integrated thermal chamber. It is the specialized solution for engineers demanding high-resolution material analysis at the highest technical level.

Precision Down to the Detail
microDAC TL - System for thermal in-plane deformation analysis on electronic components
microDAC TL
Fully automated analysis within the thermal chamber
  • Individual Temperature Profiles: Tailor-made test sequences for your specific requirements.
  • Wide Temperature Range: Reliable measurement data from -40 °C to 300 °C.
  • Fully Automated Measurement: Efficient workflows through synchronized image acquisition and seamless analysis.
  • Diverse Measurement Objects: From material samples and chip assemblies to complex printed circuit boards (PCBs).
  • Flexible Measurement Methods: Analysis of cross-sections or directly on the surface (on top).
  • Optional Multi-Position Measurement: Highest resolution at several positions within one temperature step.
  • Local Deformation Analysis: High-end evaluation using DIC software VEDDAC 7.

Characterize thermally induced expansions and contractions in local material areas more precisely than ever before – ideal for complex material composites and electronic systems.

Your Added Value: From Measurement to Optimization

The microDAC® TL provides you with a sound data basis to not only measure but targetedly control thermomechanical mechanisms:

  • CTE Determination: Determine real, locally resolved coefficients of thermal expansion.
  • Failure Analysis: Understand deformation and failure processes in complex composites.
  • Evaluate Joining Connections: Optimize soldering, sintering, and adhesive joints under thermal load.
  • Analyze Influencing Factors: Investigate the effects of component density and assembly conditions.
  • Verify FE Simulations: Experimentally validate your models for a reliable assessment of electronic packaging (AVT).
  • Design Optimization: Develop more robust and durable electronic systems.

Do you want to shorten your development cycles and increase product reliability? The microDAC® TL is the tool for researchers and engineers who do not compromise on precision.

Consultation & Contact – Get in touch with us personally:
Lutz Scheiter
Opt. Metrology / Failure Analysis
Dipl.-Ing. Bettina Seiler
Managing Director
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