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Products
microDAC® TL
Thermal in-plane deformation system microDAC® TL

As an additional feature of the thermal out-of-plane measuring system MicroProf® TL, microDAC® TL can also be used to investigate in-plane displacement fields from single electrical components to complete assemblies.

The high-precision camera setup allows the determination of global and local deformation fields with an accuracy of up to 50nm in addition to the warpage measurement.

Especially in combination with the numerical simulation the system is very beneficial. Thermomechanical material data (CTE) can be determined as input for the simulation, and also the simulation results can be verified with the help of the deformation measurement.

Brochure download (english)
Applications

The multi sensor measuring system MicroProf® TL is used for high-resolution 3D deformation measurement of thermally stressed specimens in the micro range. An automated thermal measurement in combination with the camera-based system microDAC® TL for in-plane strain and deformation measurement with a chromatic sensor for the determination of height profiles or height profile changes (warpage) takes place in the system.

A large field of application of the MicroProf® TL is the thermomechanical optimization of electronic systems.

Fields of application are

  • Clarification of thermomechanical deformation and failure mechanisms
  • Determination of thermal expansion coefficients in local material areas with highest accuracy
  • Characterization of joint connections (e.g. solder, sinter or adhesive connections) in the cross section of the material composite or electronic structure
  • Experimental verification of FE simulation results for reliability assessment
Technical specifications
Basic system MicroProf® TL:
  • Optical surface measurement at different specimen temperatures
  • Programmable temperature control
  • Temperature range from -80° to 400°C
  • High heating and cooling rate
  • Temperature stability: < 1°C
  • Fully automated
MicroProf® TL Add-on microDAC® TL
Specification Out-of-plane In-plane
Signal processing Intensity Grayscale
Kind of scan Point type Field type
Field of view 300 x 300mm² from 4.2 x 3.8mm²
up to 34 x 28mm²
Resolution lateral
(Displacement / Strain)
up to 6.0µm up to 0.19µm / 0.01%
Resolution vertical 0.25µm 1.0µm
In-plane thermal deformation measurement with microDAC® TL
In-plane thermal deformation measurement
with microDAC® TL
In-plane deformation measurement in the cross-section of a printed circuit board
In-plane deformation measurement
in the cross-section of a printed circuit board
Multisensor system MicroProf® TL for 3D deformation measurement with highest accuracy
Multisensor system MicroProf® TL
for 3D deformation measurement with highest accuracy
Thermal warpage and in-plane deformation on an electronic component (BGA) with microProf® TL
Thermal warpage and in-plane deformation
on an electronic component (BGA) with microProf® TL
 
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